Thermal conductive materials – Thermal pads

tesa® 58394

tesa® 58394 is a 125 µm thermally conductive tape designed to improve heat management in electronic assemblies. With its special acrylic adhesive, it ensures both strong adhesion and thermal conductivity, making it suitable for high-performance electronic applications.

Product Features

Special acrylic adhesive providing thermal conductivity for efficient heat transfer.
Excellent adhesion to polar substrates.
Thin 125 µm profile for optimized thermal performance.
Easy integration into electronic assembly processes.

Application Fields

tesa® 58394 is engineered for thermal management in electronics, including:

Battery module cooling plate mounting
Electronic Control Units (ECUs)
Displays
Flexible Printed Circuits (FPCs) and Printed Circuit Boards (PCBs)

Converting Services by Eko-Tech

As a tesa® Platinum Converter, Eko-Tech delivers tailored solutions for your production needs:

Custom widths and lengths through slitting and rewinding.
Die-cut and kiss-cut parts for precise assembly integration.
Laminating and multilayer constructions for complex requirements.
Application support for automated processes and thermal management optimization.

Technical data:

Adhesive Type acrylic
Backing material none
Color white
Color of liner white
Liner Type PE-coated paper
Thickness of liner 127 µm
Total thickness 125 µm
Flame retardancy V2
Temperature resistance (125°C) very good
Temperature resistance (-40°C) very good

Breakdown voltage 3.5 KV
Release of liner easy
Thermal conductivity z-direction 0.5 W/mK
Hardness – Shore 00 60 STK
Temperature resistance short term 150 °C
Density 1.8 g/cm³
Adhesion to Aluminium (after 3 days) 4.8 N/cm
Adhesion to Steel (initial) 2 N/cm
Adhesion to Steel (20min @ RT, 90°) 2 N/cm