Thermal conductive materials – Thermal pads
Solutions to improve thermal management through controlled thermal conductivity parameters.
Thermal conductivity is becoming increasingly important in our modern and technicized world. A major driving force is the increasing demand for miniaturization and automation of electronic devices in all industries. As electronics become smaller, components are becoming more concentrated in smaller and smaller spaces. The heat released during use is increasing, and with it the risk of component damage.
To maintain the longevity, safety and reliability of all electronic components, materials are needed that create a reliable heat transfer path when installed between the heat source and the heat sink.
We offer a range of products specifically designed for this purpose categorized by thickness (and thus possible use) and thermal conductivity parameter.
Our acrylic-based thermal pads work well in a wide variety of applications.
Find the right product for your automotive application
Display cases and exhibition mirrors
Battery cooling systems
eMobility and power electronics
Thermal management and automotive challenges
Our range of thermal tapes and pads
tesa® 58326
total thickness: 1200 µm
thermal conductivity in the z-direction: 2 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 0,55 N/cm
Puncture voltage: 15 KV
tesa® 58327
total thickness: 1500 µm
thermal conductivity in the z-direction: 2 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 0,57 N/cm
Puncture voltage: 15 KV
tesa® 58328
total thickness: 2000 µm
thermal conductivity in the z-direction: 2 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 0,57 N/cm
Puncture voltage: 15 KV
tesa® 58394
total thickness: 125 µm
thermal conductivity in the z-direction: 0,5 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 4,8 N/cm
Puncture voltage: 4.1 KV
tesa® 58395
total thickness: 250 µm
thermal conductivity in the z-direction: 0.6 W/mK
Temperature resistance, short term: 200 °C
adhesion to steel (20min @ RT, 90°): 5.8 N/cm
Puncture voltage: 7.4 KV
tesa® 58398
total thickness: 400 µm
thermal conductivity in the z-direction: 0,65 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 6,7 N/cm
Puncture voltage: 9.8 KV
tesa® 58399
total thickness: 800 µm
thermal conductivity in the z-direction: 0,6 W/mK
Temperature resistance, short term: 200 °C
Adhesion to Steel (20min @ RT, 90°): 5,9 N/cm
Puncture voltage: 14 KV
For these electronic applications, you can rely on us
Vapor chamber / heat pipes
5G mm wave antennas
FPC
Graphite sheet assembly
Displays
Our thermally conductive special products for electronics
tesa® 60732
type of security strip: PET film
total thickness: 50 µm
thermal conductivity in z-direction: 0.6 W/mK
adhesion to steel (initial): 4.7 N.cm
tesa® 60733
type of security strip: PET film
total thickness: 100 µm
thermal conductivity in the z-direction: 0.7 W/mK
adhesion to steel (initial): 5 N.cm
tesa® 60742
typ paska zabezpieczającego: folia PET
total thickness: 10 µm
thermal conductivity in the z-direction: 0,6 W/mK
przylepność do stali (początkowa): 3,5 N.cm
tesa® 60743
type of security strip: PET film
total thickness: 30 µm
thermal conductivity in the z-direction: 1 W/mK
adhesion to steel (initial): 4 N.cm
tesa® 60744
type of security strip: PET film
total thickness: 50 µm
thermal conductivity in the z-direction: 1 W/mK
adhesion to steel (initial): 5 N.cm
tesa® 60745
type of security strip: PET film
total thickness: 100 µm
thermal conductivity in the z-direction: 1 W/mK
adhesion to steel (initial): 4.5 N.cm
Remember – our tapes can also be used for other applications
LCD panel illumination
LCD modules
IC / CPU modules
Electric vehicle charging stations
Our products by themselves form the basis of various solutions. Combined with Our Converting capabilities and product customization to meet customer and application requirements, we can solve more than one challenge posed in various ways.
We can produce thermally conductive tapes in the form of:
Sheets of specified sizes for self-confection
Rolls of a specified width for individual cutting, e.g. using our electronic dispensers of the ZCUT series
2D blanks of a specific shape and size
Fingerlift
In addition, it is possible to confection in the sense of facilitating the application process. Such a facilitation element, for example, is the so-called Fingerlift on a special backing that will ensure easy handling and positioning of workpieces.
With our YAESU®, ENIMAC or ROBOTAPE application equipment, it is possible to automate the process of applying tape or blanks.
Contact our application manager
Łukasz Jelonek
tel. +48 603 030 332
e-mail: Lukas.Jelonek@converting-tasm.pl
Taśmy TESA®
