Flexible Printed Circuit (FPC) assembly

Automotive engine bay & electronics modules

High surface energy (HSE) metal bonding

Electronics exposed to reflow soldering

Die-cut shielding, spacers, and component bonding

Thermal interface attachment in compact electronics

Cleanroom or optics-grade adhesive bonding

Survives Up to 260°C
Built for short-term high-temp exposure—perfect for solder reflow and curing.

High Bonding Strength on HSE Materials
Ideal for bonding stainless steel, aluminum, and polyimide with minimal prep.

Non-Polymeric Liner (NP)
Enhanced for thermal stability, die-cutting, and liner removal during automation.

Low Outgassing & Clarity
Prevents contamination in optical, electronic, and cleanroom applications.

Scrim-Reinforced Adhesive Layer
Ensures dimensional stability during die cutting and long-term use.

Exceptional Holding Power
Maintains bond even under heat, load, and environmental stress.

3M-Certified Processing
We meet strict technical and quality requirements as an official 3M Select Converter.

Technical Customization
We help define formats, liner types, roll sizes, and more based on your equipment.

Prototyping to Scale
From testing to full-volume production – all under one roof.

Optimized for Automation
Formats that work seamlessly with automated or semi-automated lines.

Reliable, Responsive Partner
Based in Europe, delivering precision and speed for industries across borders.

Rewinding – Tailored to specific roll lengths

Slitting – To custom widths for continuous feed or manual use

Sheeting – Flat formats for batch processing and lamination

Die & Kiss Cutting – For precise shapes, multi-layer builds, and clean peels

Cross-Wound Spooling – Designed for high-speed, automated production systems