Flexible Printed Circuit (FPC) attachment

High-temperature electronics assembly

Bonding to high surface energy (HSE) materials like stainless steel

Sensor, switch, and thermal interface mounting

Automotive under-the-hood components

Die-cut parts in thermal zones

Optical or cleanroom-grade adhesive assemblies

Withstands High Temperatures
Short-term exposure up to 260°C (500°F) during solder reflow and thermal processing.

Strong Adhesion on HSE Surfaces
Excellent for bonding metals, polyimide films, and rigid plastics.

Low Outgassing
Maintains cleanliness in electronics, optics, and cleanroom environments.

Thin and Clear Profile
Offers high-performance bonding without altering component dimensions.

High Holding Power
Retains integrity under stress, vibration, and thermal cycling.

Die-Cut Friendly
Features a robust liner for efficient kiss-cutting and die-cutting.

Certified by 3M
We meet high standards for converting, material handling, and quality control.

Tailored Solutions
Our team adapts 3M™ 9832+ into formats that fit your production process.

Industry Expertise
Trusted by leading firms in electronics, automotive, and industrial manufacturing.

Fast Lead Times
From prototypes to high-volume runs – delivered with consistency.

European Reach, Local Reliability
Technical support and logistics adapted to your region.

Rewinding to individual roll lengths

Slitting to exact width requirements

Sheeting for manual or robotic assembly

Die & Kiss Cutting for custom shapes, tabs, or multi-layer assemblies

Cross-Wound Spooling for high-speed automatic application